- Dongguan Ziitek Electronical Material and Technology Ltd.
-
Dongguan, Guangdong, China
- Main products: Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Home > Products > Thermal Conductive Putting > High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
- 1000 Kilogram / Kilograms per Month
- Dongguam
- T/T
- 3 days
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Product Details
| Brand Name | ZIITEK | Place of Origin | China | |
| Model Number | TIE?380-25 Thermal Epoxy Glue | Type | Thermal Conductive Glue | |
| EINECS No. | TIE?380-25 Thermal Epoxy Glue | Other Names | Thermal Epoxy Glue | |
| CAS No. | TIE?380-25 Thermal Epoxy Glue | Classification | Other Adhesives | |
| Usage | Other, cooling | Main Raw Material | Other, Epoxy Glue |
Product Description
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
Product Summary:
TIE?380-25 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
Feature
| Outstanding thermal performance 2.5W/mK |
| High tack surface reduces contact resistance |
| RoHS compliant |
| UL recognized |
| Fiberglass reinforced for puncture, shear and tear resistance |
| Easy release construction |
Applications
| Heat pipe thermal solutions |
| Memory Modules |
| Mass storage devices |
| Automotive electronics |
| Set top boxes |
| Audio and video components |
| IT infrastructure |
| GPS navigation and other portable devices |
| Typical Properties of TIETM380-25 | ||
| Chemical type | Epoxy | Test Method |
| Appearance uncured | Gray Paste | Visual |
| Appearance cured | Dull Gray Solid | Visual |
| Components | One Component | ***** |
| Heat Capacity | 0.7 l/g-K | ASTM C351 |
| Key Substrates | Metals, ceramics | ***** |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temp | -40 to 180℃ | ***** |
| Tensile strength Al/Al @25°C | >2800psi | ***** |
| Thermal Conductivity | 2.5 W/m-K | ASTM D5470 |
Application Features:TIE?380-25
Color Gray
Viscosity@25℃ 140,000 cPs
Specific Gravity@25℃ 2.1 g/cc
Shelf life @25℃° 10 Days
@0℃° 6 Months
(Storage methods and temperature will affect the shelf life)
Curing procedures:
Curing temperature Curing time
100℃° 3 Hours
125℃ 1.5 Hour
150℃ 20 Minutes
170℃ 5 Minutes
Package:
1kg/can
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Contact Us
- Dongguan Ziitek Electronical Material and Technology Ltd.
- Contact nameMiss. Sophia Chat Now
- Phone86-181-53789196
- AddressBuilding B8, Industry District 2,Hengli Town, Dongguan, Guangdong
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